Every year, the power of smartphone chipsets increases, but they also get hotter due to the development of silicon chips.
Vapour chambers, also known as heat pipes, are a common part of the cooling stack as a result of the growing importance of cooling solutions.
The Xiaomi-developed Loop LiquidCool technology improves conventional heat pipes in two ways, doubling cooling efficiency.
What is the mechanism? (look at the chart above). The Evaporator segment, which is heated by the chipset, causes liquid to evaporate. The hot gas that results travels down a pipe to the Condenser, where it is cooled (for instance, by using the metal frame as a heat sink) and condensed back into liquid. The cycle is then restarted by sending this liquid to the Refill chamber, which feeds the Evaporator.
This is similar to what happens in a typical heat pipe, but there are important differences, as was already mentioned. First, the hot gas and cold liquid are maintained distinct. In heat pipes, the contact between the wick that carries the liquid and the chamber that the gas passes through limits the efficiency of the device.
The use of Tesla valves to guarantee proper circulation is the second significant change. These valves, which are easily identified by the string of teardrop shapes, were created by that Tesla inventor and do not use any moving parts to ensure that liquid flows much more easily in one direction than the other.